| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board, in which separation of a liftoff film will not occur during the manufacturing process of the wiring board, and is which a wiring conductor layer having high adhesion strength is formed. SOLUTION: In a method for manufacturing a wiring board for forming a wiring conductor layer 4 on the main surface of an insulating substrate 1, an adhesion metal layer 2a and a covering metal layer 2b are sequentially stacked to a region, where the wiring conductor layer 4 on the main surface of the insulating substrate 1 is not formed. Then a conductor layer, to be formed into the wiring conductor layer, is deposited on the covering metal layer and the exposed main-surface of the insulating substrate. Thereafter, the adhesive metal layer, the covering metal layer, and the conductor layer formed on the covering metal layer are removed. Since a liftoff film is formed of chromium and copper, there is no possibility of transformation or separation of the liftoff film due to moisture absorption or deterioration of the film due to heat applied during manufacturing process. COPYRIGHT: (C)2006,JPO&NCIPI
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