发明名称 BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To eliminate an inertial force of a bonding arm and a reaction force of a drive motor to realize highly stable high-speed bonding. SOLUTION: A bonding apparatus to be provided comprises a front link 4 whose lower end is supported on a bonding arm 1 and upper part is supported on a bonding head 7 in a rotatable manner, respectively, and a rear link 10 whose lower end is supported on the rear end of the bonding arm 1 and upper part is supported on a bonding head 7 in a rotatable manner, respectively. A capillary 2 is fitted on the bonding arm 1, and has a virtual rotation center 15 that is the intersection between the extension of a line 13 connecting upper and lower rotation centers of the front link 4 and the extension of a line 14 connecting upper and lower rotation centers of the rear link 10, and is located on a bonding surface 16. A fixed part of the drive motor 20 is fixed to the bonding head 7, and a rotating part of the drive motor 20 is fixed to the upper end of the rear link 10 so as to be capable of rotating on the upper rotation center 12 of the rear link 10. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005277325(A) 申请公布日期 2005.10.06
申请号 JP20040092176 申请日期 2004.03.26
申请人 SHINKAWA LTD 发明人 SUMIYA OSAMU;KIYONO YOSHIHIKO;KONDO YUTAKA
分类号 H01L21/60;B23K1/06;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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