| 摘要 |
PROBLEM TO BE SOLVED: To suppress the adhesion of foreign matters to a semiconductor substrate in an accommodation container when the lid of the semiconductor substrate accommodation container is opened/closed to suppress a decrease in yield of manufacture. SOLUTION: In a load port of an EFEM41 side where a FFU42 is loaded on the upper section thereof, after an FOUP for accommodating the semiconductor substrate 21 is loaded on a slide stage 33 on a load port rack 32, an FOUP shell 11 is fixed from the lower side and is moved to a load port door 31, and an FOUP door 12 is pressed against the shell. The locking of the FOUP door 12 is released and the FOUP shell is pulled inside the EFEM 41 by means of the latch key mechanism of the load port door 31. In this case, a highly pure gas in the EFEM 41 is branched and is supplied to the surrounding area of the FOUP door 12, and the purity of the air (gas) in the surrounding area is maintained at a high level, the involution of the foreign matter in the surrounding area at the time of door opening is suppressed as much as possible, thereby the adhesion of the foreign matter to the semiconductor substrate 21 is also suppressed. COPYRIGHT: (C)2006,JPO&NCIPI
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