| 摘要 |
PROBLEM TO BE SOLVED: To provide a multipiece wiring board capable of manufacturing wiring boards vertically and horizontally formed in a plurality of arrays which are excellent in electric connection reliability without generating chipping or cracks at the time of division in a thinned ceramic mother board with a wide area. SOLUTION: The multipiece wiring boards are provided with a square frame-shaped mother board 1 where wiring board regions 2 are vertically and horizontally formed in a plurality of arrays at the central part of a main surface, and a frame-shaped marginal region 4 is formed at an outer periphery, a wiring conductor formed in each wiring board region 2 and a frame-shaped outer peripheral metallized layer 5 formed so that the whole wiring board regions 2 can be surrounded in the marginal region 4. A plurality of non-through holes 6 formed along sides of the wiring board regions 2 are formed between the adjacent extended lines of boundary lines 7 of the wiring board regions 2 on the main surface of the marginal region 4. COPYRIGHT: (C)2006,JPO&NCIPI
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