| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a module with built-in circuit components which can easily accomplish a shielding effect good enough for reduction in size, height, and weight of an electronic apparatus which is responsive to higher frequency by improving the shielding property of the module with built-in circuit components. SOLUTION: In manufacturing the module with built-in circuit components, a multiple circuit board 11 is cut into single circuit boards 16. On the surface and cut faces of an insulator 14 of each single circuit board 16 divided by cutting, a first metal layer 17 is formed by electroless copper plating, a second metal layer 18 is formed by electrolytic copper plating, and a third metal layer 19 for preventing the oxidation of copper is formed by metal plating. COPYRIGHT: (C)2006,JPO&NCIPI
|
