发明名称 ETCHING TANK, AND ETCHING APPARATUS PROVIDED WITH ETCHING TANK
摘要 PROBLEM TO BE SOLVED: To provide an etching tank which keeps a temperature of an etching solution in an inner tank to eliminate the unbalance of heat distribution, reduces variations in the frequency of an etched wafer, and completely eliminates an influence from an outside environment, and to provide an etching apparatus provided with the etching tank. SOLUTION: The etching tank which has the inner tank 31 and the outer tank 32 and etches an immersed article to be etched in the etching solution in an inner tank, has a structure of making a liquid flow into the inner tank from the outside, and making the liquid which has flowed into the inner tank overflow to the outer tank and further flow to the outside; a means for keeping a temperature by the liquid which has overflowed from the inner tank into the outer tank; a magnetic rotor 8 arranged inside the inner tank; and a driving means 9 for operating the magnetic rotator with magnetic force from the outside of the inner tank. The etching apparatus is provided with the etching tank. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005272940(A) 申请公布日期 2005.10.06
申请号 JP20040088357 申请日期 2004.03.25
申请人 DAISHINKU CORP 发明人 SHIRAI TAKASHI;HAYASHI TAKASHI
分类号 C23F1/08;H01L21/306;(IPC1-7):C23F1/08 主分类号 C23F1/08
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