Vacuum processing apparatus and vacuum processing method

摘要

The invention provides a semiconductor fabrication apparatus capable of preventing increase of carriage time of samples, deterioration of sample output, increase of footprint and increase of investment costs. The vacuum processing apparatus comprises a plurality of vacuum processing chambers 3, 4 for subjecting a sample 8 to vacuum processing; a vacuum carriage means 2 for carrying the sample into and out of the vacuum processing chamber; a switchable chamber 5 capable of being switched between atmosphere and vacuum for carrying the sample into and out of the vacuum processing chamber; a cassette supporting means 9 for supporting a plurality of cassettes 7 capable of housing samples; a carriage means 6 capable of moving vertically for taking out a sample from a given cassette on the cassette supporting means; and a control means performing carriage control for carrying the sample taken out of the given cassette via the carriage means, the switchable chamber and the vacuum carriage means into the vacuum processing chamber, and for carrying the processed sample out of the vacuum processing chamber; wherein the vacuum processing chamber is equipped with an etching chamber 3 and a defect inspection chamber or CD measurement chamber 4 for inspecting the sample for defects.