发明名称 Manufacturing method of semiconductor device, semiconductor device, substrate for electro-optical device, electro-optical device, and electronic apparatus
摘要 To provide a manufacturing method of a semiconductor device, which can form an LDD (lightly doped drain) structure in a self alignment manner, can suppress the length of a doped region, and can prevent characteristics from being unstabilized when oversaturated hydrogen atoms are implanted, a semiconductor device, a substrate for electro-optical device, an electro-optical device, and an electronic apparatus. A manufacturing method of a semiconductor device comprises an electrode formation step of forming an electrode above a semiconductor layer, an insulating film formation step of forming insulating films containing nitrogen on the electrode, and a heat treatment step of performing a heat treatment under an atmosphere containing vapor, oxygen, or hydrogen to form nitrogen concentration distributions in the insulating films.
申请公布号 US2005221568(A1) 申请公布日期 2005.10.06
申请号 US20050090868 申请日期 2005.03.28
申请人 SEIKO EPSON CORPORATION 发明人 ISHIDA YUKIMASA;NOZAWA RYOICHI
分类号 H01L51/50;G02F1/1368;H01L21/00;H01L21/336;H01L21/77;H01L29/786;H05B33/10;H05B33/14;(IPC1-7):H01L21/336 主分类号 H01L51/50
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