| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer substrate structure for high-speed transmission which facilitates differential transmission with impedance matching with a transmission line. SOLUTION: An average distance between a pair of vias used in differential transmission and each ground is used to calculate mutual capacitance and inductance between the vias to set at least a radius of the via and a distance between the vias, thereby obtaining a substrate structure where differential impedance Z satisfies 0.9 Z<SB>b</SB>(Ω)≤Z≤1.1 Z<SB>b</SB>(Ω). Thus, a substrate structure for high-speed transmission permitting impedance matching with the transmission line and efficient differential transmission can be easily obtained. COPYRIGHT: (C)2006,JPO&NCIPI |
