| 发明名称 |
LEAD CHIP DIRECTLY ADHERED SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD AND DEVICE OF SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead chip directly adhered semiconductor package. <P>SOLUTION: The semiconductor package 100 comprises an integrated circuit chip 110 having an upper surface and a lower surface, a lead frame 120 that directly contacts any one of the upper surface or the lower surface of the integrated circuit chip, and an adhesive 130 which is partially formed on the lead frame. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2005277415(A) |
申请公布日期 |
2005.10.06 |
| 申请号 |
JP20050080650 |
申请日期 |
2005.03.18 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
LEE CHAN-SUK;OH SE YONG;KIM JIN-HO;LEE SANG HYEOP;KWAK MIN-KEUN;YOON SUNG-HWAN;NAM TAE-DUK |
| 分类号 |
H01L23/50;H01L21/50;H01L21/56;H01L21/58;H01L21/60;H01L23/16;H01L23/32;H01L23/495 |
主分类号 |
H01L23/50 |
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