| 摘要 |
PROBLEM TO BE SOLVED: To laminate semiconductor elements and thereby to miniaturize a semiconductor device, and to reduce the electrical resistance, as well as power loss due to a fine lead line so as to cause the semiconductor device to make it operate with a large current. SOLUTION: The semiconductor device comprises a first support board (11), a first semiconductor element (1) secured on the first support board (11), a second support board (12) secured on the first semiconductor element (1), and a second semiconductor element (2) secured on the second support (12). Each of the first support board (11) and the second support board (12) is formed of a conductive material, and has lead terminals (21a, 21b, 21c, 22a, 22b) electrically connected to the first semiconductor element (1) and the second semiconductor element (2). Since the second support board (12) satisfactorily acts as a heat dissipating board for the second semiconductor element (2), and as an electrode terminal for the semiconductor element, wirings can be simplified. COPYRIGHT: (C)2006,JPO&NCIPI |
