发明名称 METHOD OF FORMING EXTERNAL ELECTRODE EMBEDDED LAYER AND METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component that does not need a step of coating an external electrode, and eliminates a barrel polishing step. SOLUTION: A material, which disappears when it is applied with predetermined processing, is used for the material that constitutes ceramic green sheets. A plurality of the ceramic green sheets are each patterned to form chip type electronic components. Patterning and lamination are performed such that square corners of an insulator, a conductor for an internal electrode, a conductor for an external electrode, and the disappearing material, becomes substantially round. The patterning is performed using the disappearing material for the outside of the part that should become round. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005277008(A) 申请公布日期 2005.10.06
申请号 JP20040086644 申请日期 2004.03.24
申请人 TDK CORP 发明人 YOSHIDA MASAYUKI;AOKI SHUNJI;SUDO JUNICHI;WATANABE GENICHI
分类号 H01G4/12;H01F41/04;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
代理机构 代理人
主权项
地址