发明名称 COOLING APPARATUS AND METHOD OF COOLING HEATING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of blowing out cooling air, and to provide a cooling apparatus and cooling method which can evenly cool the heating elements of an electronic apparatuses, etc. by devising the shape of a plate-like heat pipe. SOLUTION: The cooling apparatus comprises a plurality of vertically arranged thermal conductors 4, each being thermally attached with the heating element 5 at least on one surface thereof, and having a radiation fin 6 thermally connected by radiation fins 6 along one end in the minor direction; and a fan 7 for blowing out the cooling air to the radiation fins 6 along the longitudinal direction of the thermal conductors 4. The plurality of thermal conductors 4 are arranged in parallel, while the radiation fins 6 are arranged in the order, in parallel with the upper ends of the thermal conductors 4. The cooling air is blown against the radiation fins 6 arranged in order. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005276917(A) 申请公布日期 2005.10.06
申请号 JP20040084774 申请日期 2004.03.23
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOYATA KEN
分类号 F25D1/00;F25D9/00;F28D15/02;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D1/00
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