| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting structure of wiring board and external circuit board which can reduce the processes up to connection from characteristic adjustment without deterioration of a dielectric material layer in the connecting structure of the wiring board and external circuit board. SOLUTION: In the connecting structure of the wiring board 10 and external circuit board 15 wherein a plurality of dielectric material layers are laminated; an internal layer conductor is electrically connected with a plurality of lower surface electrodes via a through-conductor; a plurality of lower surface electrodes are formed of connecting lower surface electrodes electrically connected to the external circuit and non-connecting lower surface electrodes 11 electrically connected to the external circuit; and the connecting lower surface electrodes of the wiring board 10 are electrically connected via a conductive connecting member 12 with the external circuit of the external circuit board 15, where a grounding conductor 14 which is provided opposing to the non-connecting lower surface electrodes 11 for capacitive coupling and is larger than the non-connecting lower surface electrode 11 is formed at the upper surface. The grounding conductor 14 of the external circuit board 15 is provided with an insulating protection layer 13 formed at a region other than that opposing to the non-connecting lower surface electrodes 11. COPYRIGHT: (C)2006,JPO&NCIPI
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