| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of coping with an environmental problem in which a wiring layer is covered with a gold plated layer including a small amount of lead and thallium. SOLUTION: The wiring board 9 is provided with an insulating base material 1 in which a wiring layer 2 is formed on the surface thereof, and a non-electrolytic gold plated layer 3 covering the wiring layer 2. The non-electrolytic gold plated layer 3 includes lead and thallium in the amount of 5 ppm or less. COPYRIGHT: (C)2006,JPO&NCIPI
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