发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which can attain excellent migration resistance and solid content concentration. SOLUTION: The present invention relates to a conductive paste comprising a binder resin (A) containing a conductive filler (B) wherein a part or all of the conductive filler (B) is noble metal powders (D) comprising silver powders (C) having a half-value width of a peak 2θ=38.05°by the X-ray diffraction method of 0.31 or less and a particle diameter of 0.5μm or less. The present invention relates to a conductive paste wherein the binder resin (A) preferably contains an epoxy resin (E). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005276773(A) 申请公布日期 2005.10.06
申请号 JP20040092313 申请日期 2004.03.26
申请人 TOYOBO CO LTD 发明人 TACHIKA HIROSHI;KONDO KOJI
分类号 H01B1/22;H01B1/00;(IPC1-7):H01B1/22 主分类号 H01B1/22
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