| 摘要 |
PROBLEM TO BE SOLVED: To securely remove impurities in a panel and achieve the improvement in the yield, a long-durability and the improvement in the emission efficiency, for example, by improving characteristics of a protective film and a fluorescent layer. SOLUTION: In a pressure reducing step, a gas is exhausted in a state of holding a baking temperature of about 300°C or more, and the impurity gas and the like remaining in a discharge space 13 are released and removed. The gas exhaust is stopped, the introduction of a pressure recovering gas is started, and the pressure in a vacuum chamber is returned to the atmospheric pressure. As the pressure recovering gas, a mixture of steam (H<SB>2</SB>O) of about 10% in the volume ratio and argon gas (Ar) is used. Here, by heat treating at the baking temperature or higher, the adhesion of H<SB>2</SB>O, CO<SB>2</SB>and the like to the surface of the protective film 6 is avoided while the containing of H<SB>2</SB>O, CO<SB>2</SB>and the like in the protective film 6 is restricted to a minimum limit. Further, since steam (H<SB>2</SB>O) which is weak in oxidative power is used as the pressure recovering gas, the oxidation of a blue light emitting body causing the degradation of emission efficiency is prevented. COPYRIGHT: (C)2006,JPO&NCIPI
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