SEMICONDUCTOR PACKAGE HAVING AN INTERFACIAL ADHESIVE LAYER

摘要

A semiconductor package comprises a substrate (8) and a semi­conductor die (2). The substrate (8) includes a plurality of contact pads (9) on its upper surface and a second plurality of external contact areas (10) on its bottom surface. The semiconductor die (2) includes an active surface with a plu­rality of die contact pads (3) electrically connected by con­ducting means (4) to contact pads (9) on the substrate (8) and a layer of first adhesive means (5) on the upper surface (18) of the die (2). Mold material (15) covers the first adhesive means (5), the die (2) and the upper surface of the substrate (8).