| 摘要 |
The invention relates to a wiring carrier design for a planar wiring carrier for receiving a plurality of chips, on the chip side of which chips of identical type are arranged in matrix-like fashion, a long narrow bonding channel surrounded by a soldering resist layer being situated in the center of each chip receptacle, and the further region of the chip receptacle area being free of soldering resist, and the chips in each case being encapsulated with a molding material. The invention is based on the object of providing a wiring carrier design with which a uniform application of adhesive can be achieved using simple means. The object is achieved by virtue of the fact that additional supporting elements ( 9 ) made of soldering resist, or made of some other suitable material, are applied on the wiring carrier ( 1 ) at least in the region of narrow stencil webs ( 8 ) that are readily flexible during the printing operation. |
