| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent breakdown of an IC chip due to an impact to be applied to a surface of a card, in regard to a non-contact IC card using an anisotropic conductive film such as ACF. <P>SOLUTION: An antenna pattern is formed on an antenna substrate, and the IC chip is mounted on the antenna substrate through a film-like adhesive so that the antenna pattern and the IC chip are electrically connected to each other, and a sealing resin is formed under the IC chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
