| 摘要 |
PROBLEM TO BE SOLVED: To facilitate verification of inspection result information, regarding a semiconductor chip formed on a semiconductor wafer. SOLUTION: A processor 10 is provided with a processing unit 15. In the unit 15, quality numbers at the same position are compared with each other, based on two pieces of inspection result information each including the position information of the semiconductor chip formed on the semiconductor wafer to obtain the correlation degree of each quality number. The display data of a wafer map image, wherein a color corresponding to the correlation degree is displayed in each corresponding region indicated by each position information, is created and this wafer map image is output to and displayed on a display unit 13 by the processing unit 15. COPYRIGHT: (C)2006,JPO&NCIPI |
