| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board capable of densifying a wiring pattern and a multilayer printed circuit board using the same. SOLUTION: The flexible printed circuit board 1 comprises wiring patterns 3, 3 formed on both sides of a thermosetting resin-impregnated glass cloth 2, and bumps 4 for connecting the wiring patterns 3, 3. The multilayer printed wiring board 11 comprises a flexible section 12 formed of part of the flexible printed circuit board 1, and a pair of nonflexible sections 13a, 13b connected to each other via the flexible section 12. The nonflexible sections 13a, 13b comprise wiring patterns 14, 15, 16, 17 formed on both sides of nonflexible insulating layers 18, 19, 20; and bumps 23 for connecting the wiring patterns 15, 16, which are laminated on the wiring patterns 3 of both sides of the flexible section 12 via a nonflexible insulating layer 22. The nonflexible sections 13a, 13b further comprise bumps 24 for connecting the wiring patterns 3, 14. COPYRIGHT: (C)2006,JPO&NCIPI |
