| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which not only assures connection reliability at the time of the mounting of a surface-mounted semiconductor device but also eliminates the defect of a lead insertion type semiconductor device without newly increasing cost, the method of cutting the lead of the same, and a lead cutting apparatus. SOLUTION: A lead cutting method comprises the steps of laying a semiconductor device on a cut die 2, making the lead 3 of the semiconductor device sandwiched by a punch guide 4 and the cut die 2, and cutting the lead 3 using a punch 5 which slides on the side surface of the punch guide 4 and the side surface of the cut die 2 in the direction of the cut die 2. In the method, a projection 1 is formed on the surface of the cut die 2 opposed to the lead 3 at a side at which the punch 5 slides. COPYRIGHT: (C)2006,JPO&NCIPI
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