发明名称 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component which precludes blisters from generating between an external electrode and a ceramic element, can form the minute external electrode, and can manufacture a laminated ceramic electronic component with high reliability, and to provide a conductive paste suitable for using the same. SOLUTION: A ceramic element 1 is comprised of internal electrodes 2a, 2b having a base metal as a main component. The method for manufacturing the ceramic electronic component comprises the step of coating the conductive paste on the ceramic element 1 to be burnt, thereby forming external electrodes 5a, 5b on the surface of the ceramic element 1. The conductive paste to be used contains a metal powder, having a base metal as a main component, a glass frit, an acrylic resin in which the mean molecular quantity is 10,000 to 100,000 and the decomposition start temperature in a thermogravimetric analysis is 250 to 350°C, and a solvent. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005277058(A) 申请公布日期 2005.10.06
申请号 JP20040087451 申请日期 2004.03.24
申请人 MURATA MFG CO LTD 发明人 SHIMIZU YASUSHI;KIZUMI TETSUYA;OKA TAKAHIRO;OMURA TAKASHI
分类号 H01G4/12;H01B1/22;(IPC1-7):H01G4/12 主分类号 H01G4/12
代理机构 代理人
主权项
地址