| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal diffusion device which suppresses film boiling causing the decrease of the thermal diffusion performance of a flat heat pipe for diffusing the heat of the electronic part even if the calorific value of the electronic part is increased, and which further raises the performance; and to provide a cooling device of the electronic part using the same. SOLUTION: Particle 3 is inserted together with operation liquid into the inside of the thermal diffusion device having an endotherm 2a and a heat dissipation part 2b. When the calorific value is increased, the particle 3 in the thermal diffusion device 2 performs a motion action by boiling phenomenon, and the particles 3 collide with each other or with a wall surface. Thus, the occurrence of the boiling film in the boiling state of the operation liquid is suppressed to raise the thermal diffusion performance. COPYRIGHT: (C)2006,JPO&NCIPI
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