发明名称 |
CONNECTION SUBSTRATE FOR ELECTRIC WIRING |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection substrate for electric wiring exhibiting excellent workability/reliability in which the size can be reduced by reducing the space required for connection, and soldering to a Hall element is facilitated. <P>SOLUTION: The connection substrate for electric wiring comprises a rigid substrate for mounting the wiring pattern of a part of electric wiring of a motor and a detector; and a flexible substrate for mounting the remaining wiring pattern wherein a Hall element can be arranged at a specified position by fixing it to the flexible substrate and then bending the flexible substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005278233(A) |
申请公布日期 |
2005.10.06 |
申请号 |
JP20040084223 |
申请日期 |
2004.03.23 |
申请人 |
YASKAWA ELECTRIC CORP |
发明人 |
NAGAMATSU YOSHIYUKI;MATSUZAKI MITSUHIRO |
分类号 |
H05K1/02;H02K11/00;H05K1/14 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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