发明名称 CONNECTION SUBSTRATE FOR ELECTRIC WIRING
摘要 <P>PROBLEM TO BE SOLVED: To provide a connection substrate for electric wiring exhibiting excellent workability/reliability in which the size can be reduced by reducing the space required for connection, and soldering to a Hall element is facilitated. <P>SOLUTION: The connection substrate for electric wiring comprises a rigid substrate for mounting the wiring pattern of a part of electric wiring of a motor and a detector; and a flexible substrate for mounting the remaining wiring pattern wherein a Hall element can be arranged at a specified position by fixing it to the flexible substrate and then bending the flexible substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005278233(A) 申请公布日期 2005.10.06
申请号 JP20040084223 申请日期 2004.03.23
申请人 YASKAWA ELECTRIC CORP 发明人 NAGAMATSU YOSHIYUKI;MATSUZAKI MITSUHIRO
分类号 H05K1/02;H02K11/00;H05K1/14 主分类号 H05K1/02
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