| 摘要 |
PROBLEM TO BE SOLVED: To fix a semiconductor device by attaching a tape to the irregular resin surface of a hardening resin layer, to suppress the chip flying at the time of dicing, and to suppress the remaining of adhesive in the recess on the surface of the resin in the hardening resin layer when the semiconductor device is picked up after dicing. SOLUTION: In performing dicing on at least one surface of the semiconductor device 1 provided with the hardening resin layer 2 having the irregular resin surface caused by recording information, a dicing adhesive tape 11 which is attached to the irregular resin surface 4 of the hardening resin layer 2 and is used to fix the semiconductor device 1, wherein the tape has a base material film 6 and an adhesive agent layer 5 of energy line hardening type provided thereon, and storage elastic modulus at the temperature of 25°C before the adhesive agent layer 5 is energy line-hardened is 1.0×10<SP>5</SP>Pa or more. COPYRIGHT: (C)2006,JPO&NCIPI |
