| 摘要 |
PROBLEM TO BE SOLVED: To improve both functions for preventing the release of abrasive grains and for improving the discharge-ability of chips in a cutting-off work by a resinoid bond wire saw. SOLUTION: Two adhesive resinoid layers 2 composed of a thermosetting resinoid layer and a photosensitive resinoid layer are arranged between the core wire 1 and the abrasive grain layer 3 of the wire saw. Helicoidal recessed portions are formed on the photosensitive resinoid layer on the abrasive grain layer 3 side. As a result, the area of the surface of the photosensitive resinoid layer increases, and the adhesive strength between the photosensitive resinoid layer and the abrasive grain layer 3 is improved, and the release of abrasive grains in the cutting-off work is prevented, and the life of the wire saw elongates. Further, because the helicoidal recessed portions corresponding to the helicoidal recessed portions of the photosensitive resinoid layer are formed on the outer surface of the abrasive grain layer 3, the discharge-ability of chips in the cutting-off work is improved and the excellent sharpness can be maintained. COPYRIGHT: (C)2006,JPO&NCIPI |
