| 摘要 |
PROBLEM TO BE SOLVED: To obtain superior bonding strength, between a semiconductor chip and a circuit board by efficiently transmitting ultrasonic vibration to the semiconductor chip from a bonding tool, without damaging the semiconductor chip. SOLUTION: A semiconductor chip 21 vacuum-chucked by a bonding tool 25 is pressed down to a circuit board 22 held by a table 24, and ultrasonic vibration is applied to the semiconductor chip 21 via the bonding tool 25 to bond the semiconductor chip 21 and the circuit board 22 with each other. The amplitude of vibration of the semiconductor chip 21 and the suction pressure of the semiconductor chip 21 chucked to the bonding tool 25 are detected during bonding step; and when the detected amplitude and the suction pressure reach predetermined values, the bonding is decided as being completed. Thereafter, the bonding status between the bonding tool 25 and the semiconductor chip 21 is relieved, and the bonding tool 25 is moved in a direction of being separated from the circuit board 22. COPYRIGHT: (C)2006,JPO&NCIPI
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