发明名称 Method and apparatus for testing defective portion of semiconductor device
摘要 An apparatus for testing a defect, includes a semiconductor element. In the semiconductor element, a conductive film is formed on an STI (shallow trench isolation) insulating film, which fills a shallow trench extending into a semiconductor region, through an insulating film in an ordinary state, and the shallow trench is not completely or sufficiently filled with the STI insulating film in a defective state. Also, the apparatus includes a control circuit configured to set a test mode in response to a test mode designation signal, a first voltage applying circuit configured to output a first voltage to the conductive film in the test mode, and a second voltage applying circuit configured to output a second voltage to the semiconductor region in the test mode. The first voltage is higher than the second voltage, and a voltage difference between the first voltage and the second voltage is sufficient to cause breakdown between the conductive film and the semiconductor region in the defective state.
申请公布号 US2005218922(A1) 申请公布日期 2005.10.06
申请号 US20050088833 申请日期 2005.03.25
申请人 NEC ELECTRONICS CORPORATION 发明人 SUZUKI JUNICHI;KANAMORI KOHJI
分类号 G01R31/28;G01R31/26;G11C16/06;G11C29/00;G11C29/06;H01L21/66;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):G01R31/26 主分类号 G01R31/28
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