CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a circuit device with excellent heat dissipation performance. Also disclosed is a method for manufacturing such a circuit device. Specifically disclosed is a circuit device (10) comprising a circuit board (16), an insulating layer (17) formed on the surface of the circuit board (16), a conductive pattern (18) formed on the surface of the insulating layer (17), and a circuit element (14) electrically connected to the conductive pattern (18). The surface of the circuit board (16) is provided with a projecting portion (25) which is partially projected from the surface and embedded in the insulating layer (17). Consequently, heat generated within the device can be dissipated outside the device more actively via the projecting portion (25).