| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can be manufactured effectively in a small number of processes, in a short time, and can realize reduction in a cost without using an expensive material or the like, and to provide its manufacturing method. SOLUTION: First and second both-sided wiring boards 10a, 10b provided with connection terminal layers 5a, 5b of a wiring pattern in the edge of through-holes 4a, 4b are prepared. The first and second both-sided wiring boards 10a, 10b are disposed so that the through-holes 4a, 4b face each other. An insulating adhesive is disposed between the first and second both-sided wiring boards 10a, 10b. The connection terminal layers 5a, 5b of the first and second both-sided wiring boards 10a, 10b are electrically connected by compressive bonding with conductive particle 11 held by the edge part of each of the through-holes 4a, 4b. COPYRIGHT: (C)2006,JPO&NCIPI |
