| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is provided with a plurality of terminals including an adjusting terminal and is packaged by resin molding wherein fracture or breakage is hard to occur, and that can be manufactured at a low cost. <P>SOLUTION: The semiconductor device 101 is provided with a plurality of terminals ta and tb1 and is packaged by resin molding. The terminals ta and tb1 include an adjusting terminal tb1 for adjusting electric characteristic of the semiconductor device 101 used during manufacturing, and the adjusting terminal tb1 is arranged inside a groove h1 that is formed on the surface of a package p. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
