| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conductive pressure-sensitive adhesive composition which has sufficient pressure-sensitive adhesiveness and heat conductivity, when used, and can safely and easily be peeled from an adherend, after used, and to provide a heat-conductive pressure-sensitive adhesive sheet. SOLUTION: This heat-conductive pressure-sensitive adhesive composition comprises 70 to 170 pts. wt. of a heat-conductive inorganic compound, 0.05 to 10 pts. wt. of a compound having a melting point of 120 to 200°C and a mol. wt. of <1,000, and 100 pts. wt. of a (meth)acrylate copolymer obtained by polymerizing 5 to 70 pts. wt. of a monomer mixture comprising 40 to 100 wt. % of a (meth)acrylate monomer, 60 to 0 wt. % of a monomer having an organic acid group, and 0 to 20 wt. % of a monomer capable of being copolymerized with the monomers, in the presence of 100 pts. wt. of a copolymer comprising 80 to 99.9 wt. % of units originated from a (meth)acrylate monomer, 0.1 to 20 wt. % of units originated from a monomer having an organic acid group, 0 to 10 wt. % of units originated from a monomer having a functional group except the organic acid group, and 0 to 10 wt. % of units originated from a monomer capable of being copolymerized with the monomers. COPYRIGHT: (C)2006,JPO&NCIPI
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