发明名称 |
Infrared transmissive integrated circuit socket cap |
摘要 |
A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.
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申请公布号 |
US2005218035(A1) |
申请公布日期 |
2005.10.06 |
申请号 |
US20040814528 |
申请日期 |
2004.03.31 |
申请人 |
PEARSON TOM E;MARTINSON ROBERT R;DISHONGH TERRY |
发明人 |
PEARSON TOM E.;MARTINSON ROBERT R.;DISHONGH TERRY |
分类号 |
H02H7/06;H02P11/00;H05K3/30;H05K3/34;(IPC1-7):H02H7/06 |
主分类号 |
H02H7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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