Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board

摘要

A multilayer wiring board (X 1 ) comprises a core portion ( 100 ) and out-core wiring portion ( 30 ). The core portion ( 100 ) comprises a carbon fiber reinforced portion ( 10 ) composed of a carbon fiber material ( 11 ) and resin composition ( 12 ), and an in-core wiring portion ( 20 ) which has a laminated structure of at least one insulating layer ( 21 ) containing a glass fiber material ( 21 a) and a wiring pattern ( 22 ) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion ( 10 ). The out-core wiring portion ( 30 ) has a laminated structure of at least one insulating layer ( 31 ) and a wiring pattern ( 32 ) and is bonded to the core portion ( 100 ) at the in-core wiring portion ( 20 ).