发明名称 Integrated circuit with metal layer having carbon nanotubes and methods of making same
摘要 A method of fabricating an integrated circuit comprises forming or providing a solution containing carbon nanotubes and forming a metal layer utilizing the solution.
申请公布号 US2005218523(A1) 申请公布日期 2005.10.06
申请号 US20040814375 申请日期 2004.03.30
申请人 DUBIN VALERY M 发明人 DUBIN VALERY M.
分类号 H01L21/288;H01L21/768;H01L23/48;H01L23/532;(IPC1-7):H01L23/48 主分类号 H01L21/288
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