发明名称 |
Plastic packaging with high heat dissipation and method for the same |
摘要 |
The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film. Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.
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申请公布号 |
US2005221537(A1) |
申请公布日期 |
2005.10.06 |
申请号 |
US20050106997 |
申请日期 |
2005.04.14 |
申请人 |
SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC. |
发明人 |
TOMABECHI SHIGEHISA;HAMANO AKIHIRO |
分类号 |
H01L21/48;H01L23/36;H01L23/373;H05K1/02;H05K1/05;H05K1/18;H05K3/02;(IPC1-7):H01L29/30 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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