| 发明名称 |
Non-magnetic, hermetically-sealed micro device package |
| 摘要 |
A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions; and (c) overlaying a palladium layer on the tungsten layer.
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| 申请公布号 |
US2005218506(A1) |
申请公布日期 |
2005.10.06 |
| 申请号 |
US20040797457 |
申请日期 |
2004.03.10 |
| 申请人 |
M/A COM, INC. |
发明人 |
GEISLER CARL;O'KEEFE DENNIS |
| 分类号 |
H01L21/50;H01L23/10;H01L23/52;H05K1/09;H05K3/24;(IPC1-7):H01L23/52 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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