| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which is excellent in the reliability of surface mounting for accurately and easily connecting an electrode of an electronic component to an electrode pad by surface mounting. <P>SOLUTION: This wiring board 9 is provided with a first insulating layer 1 formed of the loading part 1a of an electronic part surface-mounted on an upper face, a plurality of electrode pads 2 formed in the loading part 1a, a second insulating layer 5 laminated immediately before the first insulating layer 1, an inner layer wiring conductor layer 6 formed on the upper face of the second insulating layer 5, and an inner layer insulating layer 7 formed at a region overlapped with the electrode pad 2 at least when it is flatly viewed on the upper face of the second insulating layer 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
