| 摘要 |
PROBLEM TO BE SOLVED: To obtain a one-pack type epoxy resin composition that is suitable for a compression flow for simultaneously carrying out mounting on a PCB of chip or package and curing of an underfill material and has excellent flux properties. SOLUTION: The one-pack type epoxy resin composition comprises an epoxy resin (A) and a phenolcarboxylic acid (B). The blending ratio (A/B) by weight of the epoxy resin (A) to the phenolcarboxylic acid (B) is preferably 100/10-100/100. Since the one-pack type epoxy resin composition has excellent flux properties and solder connection in a compression flow is carried out, the composition is suitably useful as an underfill material for sealing a space between a semiconductor apparatus such as CSP, BGA, etc., and a circuit board to be electrically connected to the semiconductor apparatus. COPYRIGHT: (C)2006,JPO&NCIPI
|
