发明名称 METHOD OF FORMING PLASTIC MOLDING TYPE SECONDARY BATTERY
摘要 A method of forming a plastic molding type secondary battery. A protective circuit board is electrically connected to a bare cell, both mounted in a mold. The mold is capable of receiving the protective circuit board connected to the bare cell and at least a part of the bare cell, and has an insertable core corresponding to the surface of an external I/O terminal, which is axially movable so as to contact the terminal surface. Supporting pins are trans-axially dispersed in the mold so that a lateral part of the pin is in contact with the back surface of the protective circuit board disposed in a correct position. A resulting plastic molding type secondary battery has pinholes formed on a part made of the plastic molding in the direction parallel to the protective circuit board so as to come into contact with one surface of the protective circuit board.
申请公布号 KR20050096292(A) 申请公布日期 2005.10.06
申请号 KR20040021429 申请日期 2004.03.30
申请人 SAMSUNG SDI CO., LTD. 发明人 YOON, HEUI SANG
分类号 H01M2/10;H01M2/02;H01M10/04;H01M10/34;H01M10/42;(IPC1-7):H01M2/10 主分类号 H01M2/10
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