| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein tolerance over component dimentionality of a semiconductor pellet, a lead frame, and a clip is enlarged and precision prescribe of during manufacture is relieved, an assembling method of the semiconductor device, and conductive adhesive for the semiconductor device. <P>SOLUTION: The semiconductor device is provided with the semiconductor pellet 2 which has a source electrode 21 on a surface, the lead frame 1 having a source terminal 14, and the clip 3 of a plate type which is bonded to the source electrode 21 and the source terminal 14 by using the conductive adhesive 6 and by which a part between the source electrode 21 and the source terminal 14 is electrically connected. The conductive adhesive 6 contains conductor particles 61 having plasticity in binder resin. At least a part or all of particle size of the conductor particles 61 in former of plastic deformation by adhesion has scale greater than the maximum value of a gap between the source electrode 21 and the clip 3 which are to be stuck and a gap between the source terminal 14 and the clip 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
