| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency module the entire configuration of which is downsized by downsizing and integrating components of the high frequency module. <P>SOLUTION: Distributed constant lines configuring directional couplers 5, 6 in a multilayered board 23 are placed at positions overlapped with either or both of part of distributed constant lines configuring output matching circuits 26, 27 and filter elements 3a, 4a configuring a duplexer depending on a plane view. Thus, an area for mount of the filter elements 3a, 4a and power amplifier semiconductor elements 24, 25 can be secured on the surface of the multilayered board 23 so as to downsize the entire high frequency module. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
