| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with which cracks generated by dicing or advancing in a subsequent processing, are detected and a defective chip can be selected not only just after dicing but also after chip division and after product loading, and to provide the inspecting method of the device. <P>SOLUTION: Inspection wiring 4 is formed at least in a part of an outer periphery of a chip region 2 surrounded by a scribing region 3 (preferably for a whole periphery) by using an arbitrary wiring layer, a conductive material or a diffusion layer of a semiconductor chip 1. Both ends of inspection wiring 4 are connected to pads 2a of the semiconductor chip 1 directly or through a prescribed switching means via the wiring layer and a contact plug. Thus, chipping such as the cracks of the semiconductor chip, which occur due to dicing in the semiconductor chips or which advance with subsequent mounting and assembly process, and stress, shock and heat cycles after product loading is detected. The defective chip can securely be selected. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
