| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the electric resistance of an interconnection pattern without causing the increase in manhour for manufacturing, by carrying out the bank raising of the pattern by forming a metal film which is the same as that for underbump metal, also on at least a portion of the interconnection pattern provided on a substrate in the treatment of the underbump metal of a circuit device having a bump for bonding on the surface of the substrate. <P>SOLUTION: The circuit device is constituted by forming an under bump metal on the surface of a substrate 1, and providing a connecting bump 12 on the under bump metal. At least a portion of an interconnection pattern 2 and an electrode pad pattern 4 provided on the surface of the substrate 1 are exposed and a passivation film 3 is formed. When the underbump metal is formed, a metal film is formed in a laminated manner on the exposed portion of the electrode pad pattern 4 and the interconnection pattern 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
