| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition exhibiting both good adhesion to a lead frame or the like and a good low-stress property, and a semiconductor device exhibiting excellent reliability such as solder crack resistance by using the resin composition as a die attach material for the semiconductor. SOLUTION: The resin composition comprises as essential ingredients a compound (A) containing a structure represented by general formula (1) (wherein R<SB>1</SB>is a 3-6C hydrocarbon group; and n is an integer of 2-20) in the main chain skeleton and bearing at least two radically polymerizable carbon-carbon unsaturated bonds, a liquid epoxy compound (B), a phenolic compound (C), an imidazole compound (D) having a melting point of 180°C or higher, a radical polymerization initiator (E) not functioning as a photopolymerization initiator, and a filler (F). COPYRIGHT: (C)2006,JPO&NCIPI |
