| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that resist is applied and peeled each time a pattern is formed on each surface of a substrate and then the resist is consumed more. <P>SOLUTION: A patterning method of forming a substrate in a desired external shape includes the stages of: forming metal films at least on both surfaces of the substrate; forming a resist film on one surface of the substrate where the metal films are formed; exposing the resist film to a pattern in an arbitrary shape and developing it; forming a protection film on the surface of the substrate where the resist film is formed; forming a resist film on the other surface of the substrate, i.e. the surface of the substrate where the protection film is not formed; exposing the resist film formed on the other surface of the substrate to a pattern in an arbitrary shape and developing it; removing the protection film; etching the metal films exposed on both the surfaces of the substrate; and removing the resist film. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
