| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer substrate capable of connecting the ground of a microstrip line and a housing ground with low impedance in a short distance, and a transceiving module capable of being reduced in size and price. <P>SOLUTION: The multilayer substrate includes a front face layer L1 having a low frequency region where lines 30-32 for use of low frequency signals are formed and a high frequency region where lines 33 and 34 for use of high frequency signals are formed, a rear face layer L4 connected with the housing ground 40, a first inner layer L2 formed between the front face layer L1 and the rear face layer L4 to face the low frequency regions 30-32 and connected with the rear face layer L4 through a through hole TH passing from the front face layer L1 through the rear face layer L4, and a second inner layer L3 formed between the first inner layer L1 and the rear face layer L4 to face the high frequency region and connected with the rear face layer L4 through an interstitial via hole IVH. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
