| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a power supply and ground noise caused by high performance and high frequency of a semiconductor device with a BGA package mounted on a printed wiring board, and to reduce a chip capacitor mounting area used for noise reduction. <P>SOLUTION: As a mounting structure for connecting a chip capacitor 3 by solder on the power source of the backside of the mounting place of a printed wiring board connecting the BGA package 1 by solder and a through-hole pad for ground, the circuit connection distance of the power source and the ground is made shorter than that in a conventional structure. Consequently, resistance and inductance of wiring can be reduced and the power source and ground noise can be reduced. Furthermore, since mounting of the chip capacitor on an area near the BGA package in a conventional structure is eliminated, an area required for chip capacitor mounting can be greatly reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
